AMD may establish new partnership with Samsung

Previous reports indicated that Samsung and AMD had collaborated on high-bandwidth memory (HBM), with Samsung supplying HBM3 and HBM3E chips to AMD for the Instinct series compute cards to meet the demands of the artificial intelligence (AI) chip market. Additionally, Samsung integrated RDNA architecture technology into its Exynos series chips to enhance the SoC’s graphics performance.

According to KED Global, Samsung and AMD may expand their collaboration and establish a new partnership. AMD CEO Dr. Lisa Su announced at ITF World 2024 the intention to mass-produce next-generation chips using the 3nm GAA process to improve performance and energy efficiency. The packaging and interconnects will also be enhanced to make the products more energy-efficient and cost-effective. Since Samsung is the sole foundry offering this semiconductor process technology, this collaboration seems imminent.

Industry insiders regard AMD’s move as a significant strategic initiative. It is understood that AMD chose Samsung because TSMC’s 3nm capacity has been fully booked by companies like Apple and Qualcomm. Utilizing dual foundries allows AMD to diversify its supply chain, reducing dependence on TSMC.

AMD’s extensive product line includes CPUs (CCD and IOD), GPUs, DPUs, motherboard chipsets, and FPGAs. It is not yet clear which chips AMD will choose to produce with Samsung. Industry experts generally believe that AMD is likely to start with smaller chips to maximize yield rates.