AMD Unveils Ryzen AI 300 Series for Next-Gen AI Experiences

Like Intel, which plans to announce its “Lunar Lake” processors during Computex 2024, AMD has unveiled its new Ryzen AI 300 series processors, designed to meet the application requirements of Microsoft’s “Copilot+ PC.” These processors significantly enhance AI computing capabilities.

The Ryzen AI 300 series processors are built on the third-generation Ryzen AI design, utilizing the XDNA 2 architecture to achieve 50 TOPS computing power, offering up to five times the computational throughput and double the power efficiency. With the Zen 3 architecture, featuring up to 12 cores and 24 threads, computational performance is further improved, while the RDNA 3.5 graphics design employs up to 16 compute units to boost graphical performance.

AMD emphasizes that the third-generation Ryzen AI design delivers superior performance in 8-bit computation for large natural language models compared to Qualcomm Snapdragon X Elite, Intel’s “Lunar Lake” processors, and Apple’s recently unveiled M4 processor.

In terms of large natural language model execution, the Ryzen AI 300 series processors can achieve up to five times the computational power compared to the previously released Ryzen 9 8940HS. Additionally, these processors can support over 150 AI-accelerated software services available on the market, and they are fully compatible with Microsoft’s Copilot application services.

AMD highlights that the Ryzen AI 300 series processors are well-suited for the “Copilot+ PC” design requirements. They will be available in variants such as the Ryzen AI 9 HX 370, featuring 12 cores, 24 threads, a maximum clock speed of 5.1GHz, 36MB of cache, and Radeon 890M graphics. Another variant, the Ryzen AI 9 365, will feature 10 cores, 20 threads, a maximum clock speed of 5.0GHz, 34MB of cache, and Radeon 880M graphics.

To accompany the Ryzen AI 300 series processors, AMD will introduce a new product identification system. The “Ryzen AI” designation will serve as the product positioning identifier, with subsequent digits and the HX suffix indicating product grade. The first digit of the three-digit suffix represents the series version, while the last two digits denote product specifications.

The Ryzen AI 300 series processors will be available in collaboration with manufacturers such as ASUS, Acer, Dell, HP, MSI, and Lenovo, with over 100 application design products expected to be launched starting from July this year.