Google will introduce the Tensor G4 this year to power its flagship Pixel 9 series. Although previous Tensor G series chips have lagged behind competitors in performance and efficiency, Google has taken a different...
Docker has issued a warning about a critical vulnerability in certain versions of Docker Engine that allows attackers to bypass authorization plugins (AuthZ). The vulnerability, tracked as CVE-2024-41110, has received the highest CVSS score...
At COMPUTEX 2024, AMD introduced the new Zen 5 architecture and unveiled consumer-grade processors based on this architecture, including the desktop Ryzen 9000 series and the mobile Ryzen AI 300 series processors. The Ryzen...
Rapidus is a joint venture established in 2022 by eight Japanese companies, including Sony, Toyota, NTT, Mitsubishi, NEC, Kioxia, and SoftBank, to achieve localized design and manufacturing of advanced semiconductor processes. Rapidus signed a...
This March, at the GTC 2024 conference held at the San Jose Convention Center in California, NVIDIA founder and CEO Jensen Huang introduced the Blackwell architecture GPUs. These include the B200 GPU, set to...
For today’s hyperscale data centers, although solid-state drives (SSDs) are gradually transitioning to products supporting the NVMe protocol with PCIe physical interfaces, many applications still rely on Serial Attached SCSI (SAS) technology. SAS storage...
It is widely known that the iPhone series has consistently utilized Sony’s camera sensors. The latest iPhone 15 Pro Max is equipped with Sony’s IMX803 sensor, and rumors suggest that the iPhone 16 Pro...
At Computex 2024 last month, AMD officially unveiled the Ryzen AI 300 series mobile processors, and laptops equipped with these processors are now available on the market. Recently, the Ryzen AI 300 series has...
At the “AMD Tech Day 2024” event held in Los Angeles, AMD confirmed that the Ryzen 9000 series processors, codenamed “Granite Ridge,” will be released on July 31, 2024. The initial lineup comprises four...
Meta AI, an assistant built on the Llama 3.1 model, can be experienced through mobile applications and web platforms. Meta has also integrated it into their Ray-Ban Meta smart glasses. Recently, Meta announced on...
Previous reports have indicated that AMD will introduce a new ray tracing hardware module design with the RDNA 4 architecture, employing a completely different implementation compared to RDNA 3. In contrast, RDNA 3 merely...
Samsung has announced a collaboration with AMD to provide high-performance Flip Chip Ball Grid Array (FCBGA) substrates for hyperscale data center products. The company is investing 1.9 trillion Korean won to advance related technologies...
