Qualcomm Ignites AI PC Trend, Sets Sights on Data Centers
In recent months, Qualcomm has introduced the Snapdragon X Elite/Plus, designed for PCs and equipped with customized Oryon cores. Windows laptops with new processors have started to emerge. Qualcomm’s $1.4 billion acquisition of startup NUVIA in 2021 has finally borne fruit after years of anticipation.
According to Trendforce, the successful entry into the PC market and the partnership with Microsoft’s CoPilot+ PC have sparked an AI PC trend. Qualcomm CEO Cristiano Amon stated that besides mobile devices, personal computers, and automotive applications, the next focus will be on data centers. In the long run, Qualcomm’s future data center products will continue to utilize the architecture developed by the NUVIA team.
Cristiano Amon views AI PCs as a new opportunity, believing that as PCs enter a new cycle, AI engines will offer new experiences. Just as mobile phones require a slim design without overheating or becoming too cumbersome, Qualcomm has consistently focused on technological innovation rather than merely increasing power consumption. Traditional PC suppliers emphasize performance, but energy efficiency is also crucial. Amon highlighted the importance of battery life and features beyond the CPU and GPU, noting that NPUs can enhance both performance and battery efficiency, which will be key to defining leadership in the PC market.
Amon pointed out that NPUs have already demonstrated their advantages in the PC and automotive chip industries, and these capabilities can be extended to data centers and other areas. In his view, data centers represent a significant opportunity for transitioning to Arm architecture, and he believes that the potential for edge computing will grow in the future.
Previous reports have indicated that Qualcomm is also developing a server-grade chip, codenamed “SD1,” featuring 80 custom Oryon cores, measuring 98 x 95 mm, and utilizing a 9470-pin LGA socket. This chip supports 16-channel DDR5-5600 memory, boasts 70 PCIe 5.0 lanes, integrates CXL 1.1, and is manufactured using TSMC’s N5P process.
