Do Son 
The Financial Times, citing informed sources, reports that Huawei is constructing three advanced chip fabrication facilities in Guanlan, Shenzhen, as part of a broader effort to bolster its in-house semiconductor research and manufacturing capabilities—ultimately aiming to reduce its reliance on externally sourced chip production technologies.
According to the report, construction of the three facilities began in 2022. One of the plants will be directly operated by Huawei and is intended for the production of 7nm chips used in smartphones and artificial intelligence applications. This facility is expected to mark the debut of Huawei’s first fully self-developed and self-manufactured advanced-process chip.
The other two plants were completed in 2024 with financial backing from the Shenzhen municipal government. They are operated independently by SiCarrier, a semiconductor equipment firm, and SwaySure, a memory chip manufacturer.
Sources reveal that Huawei has dispatched both managerial and technical teams to assist SiCarrier and SwaySure during their initial phases of operation, including efforts to raise external capital. In certain cases, Huawei has also transferred relevant technologies to help these firms achieve a degree of technical maturity sufficient for independent operation.
While Huawei has officially denied these claims, many observers believe the company is pursuing long-term ambitions to develop technologies capable of rivaling those of NVIDIA, SK Hynix, ASML, and even TSMC’s foundry services—positioning itself to enhance competitiveness amid the escalating pressures of the U.S.–China trade conflict.
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