Pixel 9 Benchmarks Leak: Tensor G4 Shatters Performance Records

This year, Google will introduce the Tensor G4, which will power the flagship Pixel 9 series. Although the previous Tensor G series has lagged behind competitors in terms of performance and efficiency, Google has consistently upgraded its SoCs, incorporating new features to meet the specific needs of Pixel devices.

According to Wccftech, a Pixel 9 series device equipped with the Tensor G4 has appeared in a benchmark database, showing an AnTuTu score of 1,176,410, approximately 33% higher than the Pixel 8’s score of 877,443, indicating a significant performance improvement over the Tensor G3.

Notably, this device is identified as the “Pixel 9 Pro XL.” Previously, the Pixel flagship series consisted of two models, such as the Pixel 8 and Pixel 8 Pro. However, this year, the Pixel 9 series will expand to three models: Pixel 9, Pixel 9 Pro, and Pixel 9 Pro XL, all featuring the Tensor G4. The Pixel 9 Pro XL is positioned to compete with top-tier models like the iPhone 16 Pro Max and Galaxy S25 Ultra, and theoretically, due to its larger thermal configuration, it should deliver the highest performance within the series.

Rumor has it that Google’s Tensor G4, like Samsung’s Exynos 2400, will adopt fan-out wafer-level packaging (FoWLP). Compared to traditional packaging, this new technology occupies less space and provides more contact points without increasing the chip size, allowing for a thinner chip and improved thermal management. This enhances multi-core performance by better-controlling chip heat. Reports suggest that next year, the Tensor G5 will transition to TSMC for manufacturing, making the Tensor G4 likely the last Tensor chip fabricated by Samsung.