ASUS Strix Halo to Feature Massive FP11 BGA Package

At COMPUTEX 2024, AMD unveiled the new Zen 5 series architecture and announced consumer-grade processors based on this architecture, including the desktop Ryzen 9000 series and the mobile Ryzen AI 300 series. The Ryzen AI 300 series, codenamed “Strix Point,” has been accompanied by reports of a colossal APU for mobile use, codenamed “Strix Halo,” targeting high-end laptops.

According to VideoCardz, AMD Strix Halo will employ a BGA package named FP11, measuring 37.5 x 45 mm, nearly identical in size to the LGA 1700 package used by Alder Lake-S and Raptor Lake-S, and about 60% larger than the FP8 (25 x 40 mm) package used by Phoenix and Strix Point.

Leaked renderings reveal that Strix Halo uses an MCM package design, comprising three chips: two CCDs and one GCD. The CPU can house up to 16 cores, while the GPU, based on the RDNA 3.5/3+ architecture, features 40 CUs. Each Zen 5 architecture core contains 1MB of L2 cache, and each CCD with 8 cores includes 32MB of L3 cache, amounting to 16MB of L2 cache and 64MB of L3 cache. The two CCDs are interconnected with the GCD via the IF bus.

Moreover, the GCD replaces the IOD, effectively integrating a larger integrated graphics IOD, resulting in a significantly larger chip area than the combined size of the two CCDs. Besides the GPU, it includes an XDNA 2 architecture NPU with over 40 TOPS of computational power, a 32MB MALL Cache, and a 256-bit LPDDR5X memory controller. Reports suggest that Strix Halo can support up to 128GB of LPDDR5X-8000 memory.