AMD Taps Samsung for High-Performance Chip Substrates in Data Center Push
Samsung has announced a collaboration with AMD to provide high-performance Flip Chip Ball Grid Array (FCBGA) substrates for hyperscale data center products. The company is investing 1.9 trillion Korean won to advance related technologies and manufacturing capabilities to meet the highest industry standards and future technological demands.
According to Samsung, the development of packaging technology that integrates multiple semiconductor chips onto a single substrate, in partnership with AMD, is crucial for CPU and GPU applications. This advancement offers superior performance, efficiency, and flexibility, paving the way for the high-density interconnects required by hyperscale data center products. Compared to general computer substrates, data center substrates are ten times larger and have three times the number of layers, with higher demands for chip power supply and reliability.
As an essential carrier for high-performance chips such as CPUs, GPUs, and FPGAs, FCBGA substrates are increasingly in demand for emerging applications in artificial intelligence (AI), 5G, high-performance computing (HPC), smart vehicles, and data centers. Market research predicts that the substrate market will grow at an average annual rate of about 7%, increasing from 15.2 trillion Korean won in 2024 to 20 trillion Korean won by 2028.
Samsung plans to continue investing in advanced substrate solutions to meet the evolving needs of data centers and compute-intensive applications, providing products with core value for its key customers.
